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Rambus Expands High-Performance Memory Subsystem Offerings with HBM2E Solution on Samsung 14/11nm

Share this article (PRNewsfoto/Rambus Inc.) SAN JOSE, Calif., April 21, 2021 /PRNewswire/  Rambus Inc. (NASDAQ: RMBS), a provider of industry-leading chips and silicon IP making data faster and safer, today announced the Rambus HBM2E memory interface subsystem, consisting of a fully-integrated PHY and controller, is silicon proven on Samsung s advanced 14/11nm FinFET process. Leveraging over 30 years of signal integrity expertise, the Rambus solution operates up to 3.2 Gbps, delivering 410 GB/s of bandwidth. This performance meets the terabyte-scale bandwidth needs of accelerators targeting the most demanding AI/ML training and high-performance computing (HPC) applications. Our partnership with Rambus brings together industry-leading memory interface design expertise with Samsung s state-of-the-art process and packaging technologies, said Jongshin Shin, vice president of Design Platform Development at Samsung Electronics. Designers of AI and HPC systems can implement pla

Rambus Joins DARPA Toolbox Initiative with State-of-the-Art Security and Interface IP

(PRNewsfoto/Rambus Inc.) SAN JOSE, Calif., April 19, 2021 /PRNewswire/   Rambus Inc. (NASDAQ: RMBS), a provider of industry-leading chips and silicon IP making data faster and safer, today announced a commercial licensing agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to accelerate technology innovation for the agency s programs. The agreement makes all Rambus security, memory interface, and SerDes interface IP products available to DARPA researchers. As licensees, DARPA researchers benefit by having access to IP offering renowned security protection and the world s fastest chip interfaces. Rambus has the industry s broadest portfolio of state-of-the-art security IP products, and offers leading interface IP at some of the highest bandwidths available, said Sean Fan, chief operating officer at Rambus. We are excited to add our full suite of cutting-edge silicon IP to DARPA Toolbox, and look forward to the new opportunities to provide our solutions

Grace: NVIDIA kombiniert ARM-Prozessor, GPU und schnellen Interconnect

Grace: NVIDIA kombiniert ARM-Prozessor, GPU und schnellen Interconnect
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