Vimarsana
Biggest News Aggregation in the World

Page 44 - Advanced Packaging News Today : Breaking News, Live Updates & Top Stories | Vimarsana

Stay updated with breaking news from Advanced Packaging. Get real-time updates on events, politics, business, and more. Visit us for reliable news and exclusive interviews.

Top News In Advanced Packaging Today - Breaking & Trending Today

YES Joins Forces with EV Group - Vimarsana News

YES Joins Forces with EV Group

YES Joins Forces with EV Group Competence Center in Austria YES ( Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and "More-than-Moore" applications, today announced it is working with EV Group (https://www.evgroup.com/) and will install a YES EcoCoat monolayer coating system at EVG's NILPhotonics Competence Center in Austria. This collaboration will provide complete process flow demos for prospective semiconductor, life science and optical coatings (AR/VR) customers. EV Group is a major supplier of capital equi...

Yield Engineering Services, Inc. Joins Forces with EV Group - Vimarsana News

Yield Engineering Services, Inc. Joins Forces with EV Group

Yield Engineering Systems, Inc. Joins Forces with EV Group Share Article YES EcoCoat™ to be installed at EVG’s NILPhotonics® Competence Center in Austria We believe that this collaboration with EVG will help us to showcase our technologies to companies developing breakthrough products in the semiconductor, life science and AR/VR markets,” said Rezwan Lateef, President of YES. FREMONT, Calif. (PRWEB) April 19, 2021 YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced...

Source: prweb.com
Winstek Places Second Order for YES (Yield Engineering Systems, Inc.) VertaCure™ XP - Vimarsana News

Winstek Places Second Order for YES (Yield Engineering Systems, Inc.) VertaCure™ XP

Winstek Places Second Order for YES (Yield Engineering Systems, Inc.) VertaCure™ XP Share Article YES today announced that it will deliver another VertaCure™ XP, the latest version of its flagship VertaCure vacuum curing system, to Winstek Semiconductor Co., Ltd. “The VertaCure XP system’s enhanced capabilities make it especially well-suited for the demands of ‘Beyond Moore’ advanced packaging, and its ability to handle both 200 mm and 300 mm wafers is ideal for our WLCSP application,” said Cheng-Che Tsou, Director of Bumping Engineering at Winstek. ...

Source: prweb.com
ERS electronic Appoints Joshua Zhou as Vice President - Vimarsana News

ERS electronic Appoints Joshua Zhou as Vice President

ERS electronic Appoints Joshua Zhou as Vice President ERS electronic, the innovation leader in thermal management solutions for the semiconductor manufacturing industry, is appointing Joshua Zhou as Vice President. Zhou joined the company as Sales and Marketing Director in 2018 when ERS opened its China sales office in Shanghai. Joshua has more than twenty years of experience in the semiconductor industry, with global players like Texas Instruments, but also local Chinese actors like Hangzhou Nanosic technology. Over the past three years, the corporate body, first consisting of Zhou only, has...

YES Receives VertaBond™ Purchase Order from a Tier 1 Memory Manufacturer - Vimarsana News

YES Receives VertaBond™ Purchase Order from a Tier 1 Memory Manufacturer

YES Receives VertaBond™ Purchase Order from a Tier 1 Memory Manufacturer Share Article Yield Engineering Systems, Inc. announces that a leading memory manufacturer has ordered the YES VertaBond™ system for wafer-to-wafer and die-to-wafer bonding, utilized in bringing next-generation HBM (high bandwidth memory) to market. "This new VertaBond system will enable our valued customer’s most advanced HBM development and pilot production,” said Alex Chow, Asia Sales President & General Manager at YES. FREMONT, Calif. (PRWEB) Mar...

Source: prweb.com