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New institute accelerates future of microelectronic system integration, advanced packaging

New institute accelerates future of microelectronic system integration, advanced packaging
purdue.edu - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from purdue.edu Daily Mail and Mail on Sunday newspapers.

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Purdue launches institute for microelectronics development – Inside INdiana Business

Purdue launches institute for microelectronics development – Inside INdiana Business
insideindianabusiness.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from insideindianabusiness.com Daily Mail and Mail on Sunday newspapers.

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Purdue collaborates to bolster rapid technology development in U.S.

WEST LAFAYETTE – Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing and building of microelectronic systems. The new institute, announced Wednesda . ....

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