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Welcome to The On-Ramp, the newsletter published by Venable's Autonomous and Connected Mobility Team. The On-Ramp explores legal and policy developments in the world of autonomous vehicles, smart infrastructure...
Ultra Safe Nuclear Corporation talk to TCT about how binder jet 3D printing is enabling the production of its Fully-Ceramic-Microencapsulated (FCM) fuel.
An MIT EECS Alliance–backed program seeks to get more Massachusetts students into the microelectronics game by arranging internships, as well as mentorships and tours, at many different microelectronics manufacturers. The program's goal is to incentivize more students to consider pursuing a career in semiconductors and microelectronics, thus addressing a crucial, nationwide talent gap.
Qualcomm and Square Enix today announced a partnership that will see the creation of XR experiences by Square Enix, which includes the Japanese company’s subsidiary studios and intellectual property. Announced at the annual Game Developers Conference (GDC 2022) in San Francisco today, the partnership is said to involve Square Enix’s Advanced Technology Division (ATD), which […]
The U.S. Army Corps of Engineers (USACE) has awarded a contract to Gilbane-Exyte Joint Venture to build the Compound Semiconductor Laboratory – Microsystem Integration Facility (CSL-MIF) at MIT Lincoln Laboratory. The $279 million building project, s