The heatsink may finally have a much more svelte competitor
A group of researchers is studying a heatsink alternative that involves putting a coat of copper and poly that coats an entire device to help keep it cool.
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A group of researchers is studying a heatsink alternative that involves putting a coat of copper and poly that coats an entire device to help keep it cool.
Researchers at the University of Illinois at Urbana-Champaign and the University of California, Berkeley have recently devised an invention that could cool down electronics more efficiently than other alternative solutions.
Holding the right material at the right angle, Cornell researchers have discovered a strategy to switch the magnetization in thin layers of a ferromagnet – a technique that could eventually lead to the development of more energy-efficient magnetic memory devices.
Hydrogen energy is one tool that could slow climate change, but we aren’t there yet.
April 14, 2022 — Researchers at Intel and QuTech, an advanced quantum computing research center consisting of the Delft University of Technology (TU [...]