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Q&A: Ella, a robot barista, served over 100,000 cups of coffee in Singapore in 2022, say its creators - Vimarsana News

Q&A: Ella, a robot barista, served over 100,000 cups of coffee in Singapore in 2022, say its creators

A consumer-facing robot like the robot barista Ella requires more thought than one that's in a factory, say, making cars, say its creators.

New DNA Biosensor Could Unlock Powerful, Low-Cost Clinical Diagnostics - Vimarsana News

New DNA Biosensor Could Unlock Powerful, Low-Cost Clinical Diagnostics

The biosensor, developed by researchers at NIST, Brown University and the French research institute CEA-Leti , identifies biomarkers by measuring how binding occurs between DNA strands and the device.

Source: nist.gov
People Digest: MAS appoints chief sustainability officer; Crown Digital announces new hires - Vimarsana News

People Digest: MAS appoints chief sustainability officer; Crown Digital announces new hires

Crown Digital has appointed Arno Gruner as the group CFO.

New Transistor Structures At 3nm/2nm - Vimarsana News

New Transistor Structures At 3nm/2nm

New Transistor Structures At 3nm/2nm Gate-all-around FETs will replace finFETs, but the transition will be costly and difficult. Several foundries continue to develop new processes based on next-generation gate-all-around transistors, including more advanced high-mobility versions, but bringing these technologies into production is going to be difficult and expensive. Intel, Samsung, TSMC and others are laying the groundwork for the transition from today’s finFET transistors to new gate-all-around field-effect transistors (GAA FETs) at the 3nm and 2nm nodes, starting either next year or in...

CEA-Leti Scientists Present In-Memory Computing Pathways for Edge-AI & Neural Networks with 3D Architectures & Resistive-RAM - Vimarsana News

CEA-Leti Scientists Present In-Memory Computing Pathways for Edge-AI & Neural Networks with 3D Architectures & Resistive-RAM

CEA-Leti Scientists Present In-Memory Computing Pathways for Edge-AI & Neural Networks with 3D Architectures & Resistive-RAM Papers at IEDM 2020 Explore Ways to Leverage 3D Technology’s Strengths For Lowering Device Energy Consumption and Energy Lost in Data Transmission GRENOBLE, France – Dec. 17,  2020 – CEA-Leti presented two papers this week at IEDM 2020 that confirm the advantages of combining 3D architectures and resistive-random-access-memories (RRAM) for in-memory computing (IMC), and their applications for Edge-AI and neural networks. The projects were designed to look at diff...