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UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow

UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow
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New Electronics - Cadence design flows achieve certification for TSMC's N4P and N3E processes

Cadence Design Systems has announced that TSMC has certified its digital and custom/analogue design flows for the latest TSMC N4P and N3E processes in support of the new Design Rule Manual (DRM) and FINFLEX technology. ....

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New Electronics - Cadence Certus now delivers up to 10X faster concurrent full-chip optimisation and signoff

Cadence Design Systems has announced the new Certus Closure Solution that looks to address growing chip-level design size and complexity challenges. ....

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Cadence Design Flows Certified by TSMC for Latest N3E and N4P Processes

Cadence Design Flows Certified by TSMC for Latest N3E and N4P Processes
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Cadence Digital Full Flow Achieves Certification for GlobalFoundries 12LP/12LP+ Process Platforms

Cadence Digital Full Flow Achieves Certification for GlobalFoundries 12LP/12LP+ Process Platforms
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