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proteanTecs Joins the TSMC IP Alliance Program

proteanTecs Joins the TSMC IP Alliance Program
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HAIFA, Israel, March 3, 2021 /PRNewswire/ proteanTecs, a leading provider of health and performance monitoring solutions for advanced electronics, today announced it has joined the TSMC IP Alliance Program, a key component of TSMC s Open Innovation Platform® (OIP). The alliance includes major and leading IP companies, providing the semiconductor industry s largest catalog of silicon-verified, production-proven and foundry-specific intellectual property (IP).
proteanTecs joins TSMC IP Alliance Program
The company s cloud-based analytics platform provides deep data to the electronics value chain, based on Universal Chip Telemetry™ (UCT). Machine learning algorithms are applied to measurements extracted from on-chip monitoring IPs, during SoC characterization, high volume manufacturing and lifetime operation. The monitors are strategi ....

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The embedded die packaging market has been expected to grow at a CAGR of 15% during the forecast period (2020 - 2025)

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New York, Dec. 29, 2020 (GLOBE NEWSWIRE) Reportlinker.com announces the release of the report Embedded Die Packaging Market - Growth, Trends, Forecasts (2020 - 2025) - https://www.reportlinker.com/p06000980/?utm source=GNW
Micromachining and nanotechnology play an increasingly important role in the miniaturization of components ranging from biomedical applications to chemical microreactors and sensors. For instance, Bluetooth wifi modules requires minimal circuit board area on today s high-density mobile devices.
- Improved electrical & thermal performance is driving the market. For power management and mobile-wireless application the embedded technology has been evaluated to replace assembles fabrication by not only thinner thickness but due to superior thermal performance. The thermal performance of embedded die is better than PQFN with copper clip about 17%. Also a new and expandable advanced package for power devices is developed using embedded dies a ....

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