Page 7 - Yield Engineering Systems News Today : Breaking News, Live Updates & Top Stories | Vimarsana

Semiconductor Packaging News - Exclusive: YES and SPEC Sign Strategic Alliance Agreement

YES (Yield Engineering Systems, Inc.) and SPEC (Semiconductor Process Equipment Corp.) Sign Strategic Alliance Agreement Share Article Agreement covers design, manufacture and distribution of semiconductor equipment “We look forward to combining our knowledge base with YES’s large and ever-growing repository of process expertise to address customer needs,” said Kevin McGillivray, co- founder of SPEC. FREMONT, Calif. (PRWEB) June 01, 2021 YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for...

YES Joins Forces with EV Group Competence Center in Austria YES ( Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and "More-than-Moore" applications, today announced it is working with EV Group (https://www.evgroup.com/) and will install a YES EcoCoat monolayer coating system at EVG's NILPhotonics Competence Center in Austria. This collaboration will provide complete process flow demos for prospective semiconductor, life science and optical coatings (AR/VR) customers. EV Group is a major supplier of capital equi...

Yield Engineering Systems, Inc. Joins Forces with EV Group Share Article YES EcoCoat™ to be installed at EVG’s NILPhotonics® Competence Center in Austria We believe that this collaboration with EVG will help us to showcase our technologies to companies developing breakthrough products in the semiconductor, life science and AR/VR markets,” said Rezwan Lateef, President of YES. FREMONT, Calif. (PRWEB) April 19, 2021 YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced...

Winstek Places Second Order for YES (Yield Engineering Systems, Inc.) VertaCure™ XP Share Article YES today announced that it will deliver another VertaCure™ XP, the latest version of its flagship VertaCure vacuum curing system, to Winstek Semiconductor Co., Ltd. “The VertaCure XP system’s enhanced capabilities make it especially well-suited for the demands of ‘Beyond Moore’ advanced packaging, and its ability to handle both 200 mm and 300 mm wafers is ideal for our WLCSP application,” said Cheng-Che Tsou, Director of Bumping Engineering at Winstek. ...