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Using 3D Optical Profiling for Full-Field Hotspot Detection

Chemical mechanical polishing (CMP) – also known as planarization – has long been the most commonly employed technique for smoothing and flattening wafer surfaces during the fabrication of semiconductor integrated chips (IC). This approach has been common practice for decades.
During this time, post-CMP evaluation has become the standard means of ensuring adequate planarity of IC layers, as well as the most common approach to confirming their compliance with planarity requirements.
Conventional post-CMP process evaluation methods have analytical limitations, however. Ever tightening process control limits have led to an increasing need for improved accuracy in the wafer surface characterization methods used in semiconductor chip manufacturing. ....

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Equipment Front End Module (EFEM) Systems Market 2021 Global Outlook – Robots and Design, Genmark Automation, Yaskawa Electric, Hirata Corporation – KSU

/Equipment Front End Module (EFEM) Systems Market 2021 Global Outlook – Robots and Design, Genmark Automation, Yaskawa Electric, Hirata Corporation
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Equipment Front End Module (EFEM) Systems Market 2021 Global Outlook – Robots and Design, Genmark Automation, Yaskawa Electric, Hirata Corporation
tanmayApril 18, 2021
Global “
Equipment Front End Module (EFEM) Systems Market” 2021 Research report produces information with reference to market size, share, trends, growth, cost structure, capacity, revenue, and forecast 2026. This report also contains the general and comprehensive study of the Equipment Front End Module (EFEM) Systems market with all its aspects influencing the growth of the market. This report is a full-scale quantitative survey of the Equipment Front End Module (EFEM) Systems industry and provides data for building strategies to expand the market growth and effectiveness. ....

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