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Characterizing Microlenses via White Light Interferometry - Vimarsana News

Characterizing Microlenses via White Light Interferometry

Because of their ever-increasing use in a variety of applications, microlenses and their design are constantly being improved to reduce distortion, astigmatism, or other problems that can impede observation. In this article, Bruker explains how white light interferometry can be used to characterize microlenses.

Source: azom.com
Bruker Introduces Next-Generation 3D Areal Surface Measurement Technology for Production and Research Environments - Vimarsana News

Bruker Introduces Next-Generation 3D Areal Surface Measurement Technology for Production and Research Environments

At the SPIE Photonics West 2023 Exhibition, Bruker Corporation today announced the release of two new white-light interferometry (WLI) systems: the ContourX-1000 and NPFLEX-1000 optical profilometers.

Source: azom.com
Quality Control in Surface Metrology Through Software Integration - Vimarsana News

Quality Control in Surface Metrology Through Software Integration

In this article, Digital Surf discusses how their partnership with Bruker has led to the development of a fully integrated surface metrology quality control analysis solution.

Source: azom.com
Using 3D Optical Profiling for Full-Field Hotspot Detection - Vimarsana News

Using 3D Optical Profiling for Full-Field Hotspot Detection

Chemical mechanical polishing (CMP) – also known as planarization – has long been the most commonly employed technique for smoothing and flattening wafer surfaces during the fabrication of semiconductor integrated chips (IC). This approach has been common practice for decades. During this time, post-CMP evaluation has become the standard means of ensuring adequate planarity of IC layers, as well as the most common approach to confirming their compliance with planarity requirements. Conventional post-CMP process evaluation methods have analytical limitations, however. Ever tightening proce...

Source: azom.com