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Top News In Design Ecosystem Today - Breaking & Trending Today

Cadence and Intel Foundry Collaborate to Enable Heterogeneous Integration with EMIB Packaging Technology

Cadence and Intel Foundry have collaborated to develop and certify an integrated advanced packaging flow utilizing Embedded Multi-die Interconnect Bridge (EMIB) technology to address the growing complexity in heterogeneously integrated multi-chip(let) architectures. The collaboration enables Intel customers to leverage advanced packaging to accelerate the high-performance computing (HPC), AI, and mobile computing design space. The advanced… ....

Rahul Goyal , Michael Jackson , Group At Cadence , Intel Foundry , Embedded Multi Die Interconnect Bridge , Integrity System Planner , Verification System , Corporate Vice President , Vice President , General Manager , Design Ecosystem ,

Siemens collaborates with Intel Foundry to contribute 3D-IC technology leadership for Intel's EMIB reference flow – EEJournal

Siemens Digital Industries Software today announced it has collaborated with Intel Foundry to develop a comprehensive workflow for the foundry’s embedded multi-die interconnect bridge (EMIB) approach to in-package, high-density interconnect of heterogeneous chips. Leveraging the expertise and world class technology of Siemens' industry leading IC and PCB design portfolios, Intel’s EMIB technology delivers advanced integrated… ....

Rahul Goyal , Siemens Xcelerator , Package Assembly Design Kit , Siemens Digital Industries Software , Intel Foundry , Vice President , General Manager , Design Ecosystem , Substrate Integrator , Package Designer , Electronic Board Systems , Siemens Digital Industries , Digital Industries Software ,

New Electronics - Siemens collaborates with Intel Foundry to develop EMIB reference flow

Siemens Digital Industries Software is collaborating with the Intel Foundry in the development of a comprehensive workflow for the foundry’s embedded multi-die interconnect bridge (EMIB) approach to in-package, high-density interconnect of heterogeneous chips. ....

Rahul Goyal , Package Assembly Design Kit , Leveraging Siemen , Vice President , General Manager , Design Ecosystem , Intel Foundry , Xpedition Substrate Integrator , Xpedition Package Designer ,

Synopsys and Intel Foundry Accelerate Advanced Chip Designs with Synopsys IP and Certified EDA Flows for Intel 18A Process

Close Collaboration with EDA Flows and Broad IP Portfolio Enables Chipmakers to Boost Performance and Speed Time to Market Highlights: Synopsys digital and. ....

Kelli Wheeler , Rahul Goyal , Shankar Krishnamoorthy , Prnewswire Synopsys Inc , Synopsys Foundation , Synopsys Inc , Close Collaboration , Enables Chipmakers , Boost Performance , Speed Time , Intel Foundry , Intel Foundry Direct Connect , Aart De Geus , Sysmoore Together , Vice President , General Manager , Design Ecosystem , Performance Gains , Synopsys Analog Quickstart Kit , Synopsys Custom Compiler , Synopsys Multi Die System Solution , Digital Design Family , Custom Design Family , Electronic Components , Computer Software , Electronic Design Automation ,

Synopsys (SNPS) and Intel (INTC) Foundry Accelerate Advanced Chip Designs with Synopsys IP and Certified EDA Flows for Intel 18A Process

Synopsys (SNPS) and Intel (INTC) Foundry Accelerate Advanced Chip Designs with Synopsys IP and Certified EDA Flows for Intel 18A Process
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Shankar Krishnamoorthy , Rahul Goyal , Synopsys Inc , Synopsys Foundation , Intel Foundry , Intel Foundry Direct Connect , Sysmoore Together , Vice President , General Manager , Design Ecosystem , Performance Gains , Synopsys Analog Quickstart Kit , Synopsys Custom Compiler , Synopsys Multi Die System Solution , Synopsys Digital Design Family , Synopsys Custom Design Family ,