Advanced Packaging Technologies Market Growth Forecast Analysis by Manufacturers, Regions, Type and According to Stratistics MRC, the Advanced Packaging Technology Market is growing at a CAGR of 8.6% from 2017 to 2026. BriefingWire.com, 5/06/2021 - According to Stratistics MRC, the Advanced Packaging Technology Market is growing at a CAGR of 8.6% from 2017 to 2026. The growth factors include increasing demand for fresh and quality packaged food, manufacturer concern for the longer shelf life of the food products, imminent requirement for size reduction in electronic devices, less power consumption. However, the heating problem in devices restrains the market growth. Advanced packaging technology is intended to the commercial reality for most integrated-circuit (IC) manufacturers is that node migrations and changes in wafer sizes are slowing down even as capital expenditures are increasing. One way for manufacturers to preserve their edge on their circuitsâ small sizes, low costs, and high performance is to incorporate newer chip-packaging options such as 2.5-D integrated circuits (2.5DICs) and 3-D integrated circuits (3.0DICs) into their production processes.